Reflow soldering processes : SMT, BGA, CSP and flip chip technologies / Ning-Cheng Lee.
Material type:
TextPublisher: Boston : Newnes, [2002]Copyright date: ©2002Description: ix, 270 pages : illustrations ; 26 cmContent type: - text
- unmediated
- volume
- 0750672188
- 9780750672184
- 621.381046
- TK7836. L43 2002
Contents:
1. Introduction to Surface Mount Technology -- 2. Fundamentals of Solders and Soldering -- 3. Solder Past Technology -- 4. Surface Mount Assembly Processes -- 5. SMT Problems Prior to Reflow -- 6. SMT Problems During Reflow -- 7. SMT Problems at the Post-reflow Stage -- 8. Solder Bumping for Area Array Packages -- 9. BGA and CSP Assembly and Rework -- 10. Flip Chip Reflow Attachment -- 11. Optimizing a Reflow Profile Via Defect Mechanisms Analysis -- 12. Lead-free Soldering.
| Item type | Current library | Call number | Copy number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|---|
| Book | City Campus City Campus Main Collection | 621.381046 LEE (Browse shelf(Opens below)) | 1 | Available | A408518B |
Browsing City Campus shelves, Shelving location: City Campus Main Collection Close shelf browser (Hides shelf browser)
| 621.381044 BUS Digital control in power electronics / | 621.381044 JAC Power electronics : principles & applications / | 621.381044 TAN Sliding mode control of switching power converters : techniques and implementation / | 621.381046 LEE Reflow soldering processes : SMT, BGA, CSP and flip chip technologies / | 621.381078 HAY Student manual for The art of electronics / | 621.38109 MOR Electronics : the life story of a technology / | 621.3813 COL Foundations for microwave engineering / |
Includes bibliographical references and index.
1. Introduction to Surface Mount Technology -- 2. Fundamentals of Solders and Soldering -- 3. Solder Past Technology -- 4. Surface Mount Assembly Processes -- 5. SMT Problems Prior to Reflow -- 6. SMT Problems During Reflow -- 7. SMT Problems at the Post-reflow Stage -- 8. Solder Bumping for Area Array Packages -- 9. BGA and CSP Assembly and Rework -- 10. Flip Chip Reflow Attachment -- 11. Optimizing a Reflow Profile Via Defect Mechanisms Analysis -- 12. Lead-free Soldering.
Machine converted from AACR2 source record.
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