Reflow soldering processes : SMT, BGA, CSP and flip chip technologies /
Lee, Ning-Cheng,
Reflow soldering processes : SMT, BGA, CSP and flip chip technologies / Ning-Cheng Lee. - ix, 270 pages : illustrations ; 26 cm
Includes bibliographical references and index.
Introduction to Surface Mount Technology -- Fundamentals of Solders and Soldering -- Solder Past Technology -- Surface Mount Assembly Processes -- SMT Problems Prior to Reflow -- SMT Problems During Reflow -- SMT Problems at the Post-reflow Stage -- Solder Bumping for Area Array Packages -- BGA and CSP Assembly and Rework -- Flip Chip Reflow Attachment -- Optimizing a Reflow Profile Via Defect Mechanisms Analysis -- Lead-free Soldering. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12.
0750672188 9780750672184
2001031713
Electronic apparatus and appliances--Design and construction
Solder and soldering
Electronic packaging
Electric connectors
TK7836. / L43 2002
621.381046
Reflow soldering processes : SMT, BGA, CSP and flip chip technologies / Ning-Cheng Lee. - ix, 270 pages : illustrations ; 26 cm
Includes bibliographical references and index.
Introduction to Surface Mount Technology -- Fundamentals of Solders and Soldering -- Solder Past Technology -- Surface Mount Assembly Processes -- SMT Problems Prior to Reflow -- SMT Problems During Reflow -- SMT Problems at the Post-reflow Stage -- Solder Bumping for Area Array Packages -- BGA and CSP Assembly and Rework -- Flip Chip Reflow Attachment -- Optimizing a Reflow Profile Via Defect Mechanisms Analysis -- Lead-free Soldering. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12.
0750672188 9780750672184
2001031713
Electronic apparatus and appliances--Design and construction
Solder and soldering
Electronic packaging
Electric connectors
TK7836. / L43 2002
621.381046