MARC details
| 000 -LEADER |
|---|
| fixed length control field |
01996cam a22004214i 4500 |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
|---|
| control field |
20221101191728.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
|---|
| fixed length control field |
010425s2002 maua b 001 0 eng d |
| 010 ## - LIBRARY OF CONGRESS CONTROL NUMBER |
|---|
| LC control number |
2001031713 |
| 011 ## - LINKING LIBRARY OF CONGRESS CONTROL NUMBER [OBSOLETE] |
|---|
| Local cataloguing issues note |
BIB MATCHES WORLDCAT |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
0750672188 |
| Qualifying information |
alk. paper |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
9780750672184 |
| Qualifying information |
alk. paper |
| 035 ## - SYSTEM CONTROL NUMBER |
|---|
| System control number |
(ATU)b10634381 |
| 035 ## - SYSTEM CONTROL NUMBER |
|---|
| System control number |
(DLC) 2001031713 |
| 035 ## - SYSTEM CONTROL NUMBER |
|---|
| System control number |
(OCoLC)46929244 |
| 040 ## - CATALOGING SOURCE |
|---|
| Original cataloging agency |
DLC |
| Language of cataloging |
eng |
| Description conventions |
rda |
| Modifying agency |
ATU |
| 042 ## - AUTHENTICATION CODE |
|---|
| Authentication code |
pcc |
| 050 00 - LIBRARY OF CONGRESS CALL NUMBER |
|---|
| Classification number |
TK7836. |
| Item number |
L43 2002 |
| 082 0# - DEWEY DECIMAL CLASSIFICATION NUMBER |
|---|
| Classification number |
621.381046 |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
|---|
| Personal name |
Lee, Ning-Cheng, |
| Relator term |
author. |
| 9 (RLIN) |
1041560 |
| 245 10 - TITLE STATEMENT |
|---|
| Title |
Reflow soldering processes : |
| Remainder of title |
SMT, BGA, CSP and flip chip technologies / |
| Statement of responsibility, etc. |
Ning-Cheng Lee. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE |
|---|
| Place of production, publication, distribution, manufacture |
Boston : |
| Name of producer, publisher, distributor, manufacturer |
Newnes, |
| Date of production, publication, distribution, manufacture, or copyright notice |
[2002] |
| 264 #4 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE |
|---|
| Date of production, publication, distribution, manufacture, or copyright notice |
©2002 |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
ix, 270 pages : |
| Other physical details |
illustrations ; |
| Dimensions |
26 cm |
| 336 ## - CONTENT TYPE |
|---|
| Content type term |
text |
| Content type code |
txt |
| Source |
rdacontent |
| 337 ## - MEDIA TYPE |
|---|
| Media type term |
unmediated |
| Media type code |
n |
| Source |
rdamedia |
| 338 ## - CARRIER TYPE |
|---|
| Carrier type term |
volume |
| Carrier type code |
nc |
| Source |
rdacarrier |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE |
|---|
| Bibliography, etc. note |
Includes bibliographical references and index. |
| 505 00 - FORMATTED CONTENTS NOTE |
|---|
| Miscellaneous information |
1. |
| Title |
Introduction to Surface Mount Technology -- |
| Miscellaneous information |
2. |
| Title |
Fundamentals of Solders and Soldering -- |
| Miscellaneous information |
3. |
| Title |
Solder Past Technology -- |
| Miscellaneous information |
4. |
| Title |
Surface Mount Assembly Processes -- |
| Miscellaneous information |
5. |
| Title |
SMT Problems Prior to Reflow -- |
| Miscellaneous information |
6. |
| Title |
SMT Problems During Reflow -- |
| Miscellaneous information |
7. |
| Title |
SMT Problems at the Post-reflow Stage -- |
| Miscellaneous information |
8. |
| Title |
Solder Bumping for Area Array Packages -- |
| Miscellaneous information |
9. |
| Title |
BGA and CSP Assembly and Rework -- |
| Miscellaneous information |
10. |
| Title |
Flip Chip Reflow Attachment -- |
| Miscellaneous information |
11. |
| Title |
Optimizing a Reflow Profile Via Defect Mechanisms Analysis -- |
| Miscellaneous information |
12. |
| Title |
Lead-free Soldering. |
| 588 ## - SOURCE OF DESCRIPTION NOTE |
|---|
| Source of description note |
Machine converted from AACR2 source record. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Electronic apparatus and appliances |
| General subdivision |
Design and construction |
| 9 (RLIN) |
786385 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Solder and soldering |
| 9 (RLIN) |
324278 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Electronic packaging |
| 9 (RLIN) |
317204 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Electric connectors |
| 9 (RLIN) |
317064 |
| 907 ## - LOCAL DATA ELEMENT G, LDG (RLIN) |
|---|
| a |
.b10634381 |
| b |
03-10-17 |
| c |
27-10-15 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
|---|
| Koha item type |
Book |
| 945 ## - LOCAL PROCESSING INFORMATION (OCLC) |
|---|
| a |
621.381046 LEE |
| g |
1 |
| i |
A408518B |
| j |
0 |
| l |
cmain |
| o |
- |
| p |
$35.33 |
| q |
- |
| r |
- |
| s |
- |
| t |
0 |
| u |
3 |
| v |
0 |
| w |
1 |
| x |
0 |
| y |
.i11481122 |
| z |
28-10-15 |
| 998 ## - LOCAL CONTROL INFORMATION (RLIN) |
|---|
| -- |
(2)b |
| -- |
(2)c |
| Operator's initials, OID (RLIN) |
06-04-16 |
| Cataloger's initials, CIN (RLIN) |
m |
| First date, FD (RLIN) |
a |
| -- |
eng |
| -- |
mau |
| -- |
0 |
