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Reflow soldering processes : SMT, BGA, CSP and flip chip technologies / Ning-Cheng Lee.

By: Material type: TextTextPublisher: Boston : Newnes, [2002]Copyright date: ©2002Description: ix, 270 pages : illustrations ; 26 cmContent type:
  • text
Media type:
  • unmediated
Carrier type:
  • volume
ISBN:
  • 0750672188
  • 9780750672184
Subject(s): DDC classification:
  • 621.381046
LOC classification:
  • TK7836. L43 2002
Contents:
1. Introduction to Surface Mount Technology -- 2. Fundamentals of Solders and Soldering -- 3. Solder Past Technology -- 4. Surface Mount Assembly Processes -- 5. SMT Problems Prior to Reflow -- 6. SMT Problems During Reflow -- 7. SMT Problems at the Post-reflow Stage -- 8. Solder Bumping for Area Array Packages -- 9. BGA and CSP Assembly and Rework -- 10. Flip Chip Reflow Attachment -- 11. Optimizing a Reflow Profile Via Defect Mechanisms Analysis -- 12. Lead-free Soldering.
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Holdings
Item type Current library Call number Copy number Status Date due Barcode
Book City Campus City Campus Main Collection 621.381046 LEE (Browse shelf(Opens below)) 1 Available A408518B

Includes bibliographical references and index.

1. Introduction to Surface Mount Technology -- 2. Fundamentals of Solders and Soldering -- 3. Solder Past Technology -- 4. Surface Mount Assembly Processes -- 5. SMT Problems Prior to Reflow -- 6. SMT Problems During Reflow -- 7. SMT Problems at the Post-reflow Stage -- 8. Solder Bumping for Area Array Packages -- 9. BGA and CSP Assembly and Rework -- 10. Flip Chip Reflow Attachment -- 11. Optimizing a Reflow Profile Via Defect Mechanisms Analysis -- 12. Lead-free Soldering.

Machine converted from AACR2 source record.

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