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Reliability of microtechnology : interconnects, devices, and systems / Johan Liu [and others].

By: Material type: TextTextPublisher: New York ; London : Springer, [2011]Copyright date: ©2011Description: xiii, 204 pages : illustrations ; 24 cmContent type:
  • text
Media type:
  • unmediated
Carrier type:
  • volume
ISBN:
  • 1441957596
  • 9781441957597
Subject(s): DDC classification:
  • 621.381 22
LOC classification:
  • TK7875 .R45 2011
Contents:
1. Introduction to Reliability and Its Importance -- 2. Reliability Metrology -- 3. General Failure Mechanisms of Microsystems -- 4. Solder Joint Reliability -- 5. Conductive Adhesive Joint Reliability -- 6. Accelerated Testing -- 7. Reliability Design for Manufacturability -- 8. Component Reliability -- 9. System Level Reliability -- 10. Reliability and Quality Management of Microsystem -- 11. Experimental Tools for Reliability Analysis -- --
1. Introduction to Reliability and Its Importance -- 1.1. Introduction -- 2. Reliability Metrology -- 2.1. The Definition of Reliability -- 2.2. Empirical Models -- 2.3. Physical Models -- 2.4. Reliability Information -- 2.5. Interconnection Reliability -- 2.6. The Levels of Interconnections -- 2.7. Reliability Function -- 2.7.1. Exponential Distribution -- 2.7.2. Weibull Distribution -- 2.7.3. Log-Normal Distribution -- 2.7.4. Physical Basis of the Distributions -- 2.8. A Generic Weibull Distribution Model to Predict Reliability of Microsystems -- 2.8.1. Failure-Criteria Dependence of the Location Parameter -- 2.8.2. Least Squares Estimation -- 2.8.3. The Experiment and Data -- 2.8.4. Analysis and the Results -- 2.8.5. Application of the Results -- 3. General Failure Mechanisms of Microsystems -- 3.1. Introduction -- 3.2. Mechanical and Thermomechanical Failure Mechanisms -- 3.2.1. Low Cycle Fatigue -- 3.2.2. Creep -- 3.3. Brittle Fracture -- 3.4. IC Level Failure Mechanisms -- 3.4.1. Electromigration -- 3.4.2. Electrostatic Discharge -- 3.5. Corrosion -- 3.6. Plastic Package Popcorning -- 4. Solder Joint Reliability -- 4.1. Microstructure of Solder Joints -- 4.1.1. Microstructure of Eutectic Sn-37Pb -- 4.1.2. Microstructural Stability and Interfacial Interactions -- 4.1.3. Microstructure of Eutectic Sn-3.5Ag -- 4.1.4. Microstructural Evolution and Interfacial Interactions -- 4.1.5. Microstructure of Sn-Ag-Cu Alloys -- 4.1.6. Microstructural Evolution and Interfacial Interactions -- 4.1.7. Microstructure of Sn-3.5Ag-3Bi -- 4.1.8. Microstructure of Sn-07Cu0.4Co -- 4.2. Mechanical Reliability of Solder Joints -- 4.2.1. Fatigue Failure -- 4.3. General Solder Joint Failure Mechanism -- 4.3.1. Effect of Second Level Solder Interconnection Failure -- 4.3.2. Standards Related to Solder Joint Reliability Testing -- 5. Conductive Adhesive Joint Reliability -- 5.1. Introduction to Conductive Adhesives -- 5.2. Isotropic Conductive Adhesive -- 5.3. Reliability of ICA Interconnects -- 5.3.1. Effect of Metallization -- 5.3.2. Effect of Curing Degree -- 5.3.3. Impact Strength -- 5.3.4. Failure Mechanisms -- 5.3.5. Electron Conduction Through Nanoparticles in ICA -- 5.4. Reliability of ACA Interconnects -- 5.4.1. Effects of Assembly Process -- 5.4.2. Effects of Substrate and Component -- 5.4.3. Degradation Due to Moisture Absorption -- 5.4.4. Oxidation and Crack Growth -- 5.4.5. Probabilities of Open and Bridging -- 5.4.6. ACA Flow During Bonding -- 5.4.7. Electrical Conduction Development and Residual Stresses -- 6. Accelerated Testing -- 6.1. Fatigue Failure Analysis for Accelerated Testing -- 6.2. Thermal Fatigue -- 6.3. Effect of Different Test Factors on Thermal Fatigue Life -- 6.4. Isothermal Mechanical LCF -- 6.4.1. Effect of Frequency -- 6.4.2. Effect of Dwell (Hold) Time -- 6.4.3. Effect of Strain Range and Strain Rate -- 6.4.4. Effect of Temperature -- 6.4.5. Effect of Failure Definition -- 6.4.6. Effect of Other Factors -- 7. Reliability Design for Manufacturability -- 7.1. Lead-Free Soldering -- 7.1.1. Higher Process Temperature -- 7.2. Other Issues -- 7.2.1. Lead Contamination -- 7.2.2. Tin Whiskers -- 7.3. Inspection -- 7.4. Repair and Rework -- 8. Component Reliability -- 8.1. Introduction -- 8.2. Empirical Models -- 8.3. The Methodology -- 8.4. Empirical Models in System Reliability Analysis -- 8.5. Limitations of Empirical Models and Recommendations on Use -- 9. System Level Reliability -- 9.1. Introduction -- 9.2. Some Constant Hazard Rate Approximations of the Weibull Distribution -- 9.3. Resulting Functions and Hazard Rates -- 9.4. Properties of Different Options -- 9.5. Comparison of the Selected Options -- 9.6. Selection of Time Intervals -- 9.7. The Motivation for Selecting Two-Parameter Weibull Distribution -- 9.8. Constant Failure Rate and Its Origin in the Field Failure Data -- 10. Reliability and Quality Management of Microsystem -- 10.1. Introduction -- 10.2. Activity 1: Product Requirements and Constraints -- 10.3. Activity 2: Product Life-Cycle Conditions -- 10.4. Activity 3: Selection and Characterization of Alternative Product Architectures and Manufacturing Processes -- 10.5. Activity 4: Qualification of Packaging Concepts and Manufacturing Processes -- 10.5.1. Manufacturability -- 10.5.2. Reliability -- 10.5.3. Maintainability -- 10.5.4. Environmental Compatibility -- 10.6. Activity 5: Risk Management and Balance of Functionality, Quality, and Cost Requirements -- 10.6.1. Risk Management of Supplied Materials and Parts -- 10.6.2. Risk Management of Manufacturing Processes and New Technologies -- 10.6.3. Failure Modes and Effects Analysis -- 10.6.4. Protective Measures -- 10.7. Activity 6: Quality Controls and Improvement of Design, Materials, Parts, and Manufacturing Processes -- 10.7.1. Design Defects -- 10.7.2. Defects Caused by Manufacturing Processes -- 10.8. Activity 7: Failure Analysis and Feedback of Gained Knowledge -- 11. Experimental Tools for Reliability Analysis -- 11.1. Optical Microscopy -- 11.2. Scanning Electron Microscopy -- 11.3. Energy-Dispersive X-Ray -- 11.4. Scanning Acoustic Microscopy -- 11.5. X-Ray -- 11.6. Low-Cycle Fatigue Testing -- 11.7. Shear Testing -- 11.8. Humidity and Temperature Testing -- 11.9. Thermal Shock and Thermal Cycling Testing -- 11.10. Moire Interferometry.
Summary: "Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail"--Publisher's website.
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Holdings
Item type Current library Call number Copy number Status Date due Barcode
Book City Campus City Campus Main Collection 621.381 REL (Browse shelf(Opens below)) 1 Available A502395B

Includes bibliographical references and index.

1. Introduction to Reliability and Its Importance -- 2. Reliability Metrology -- 3. General Failure Mechanisms of Microsystems -- 4. Solder Joint Reliability -- 5. Conductive Adhesive Joint Reliability -- 6. Accelerated Testing -- 7. Reliability Design for Manufacturability -- 8. Component Reliability -- 9. System Level Reliability -- 10. Reliability and Quality Management of Microsystem -- 11. Experimental Tools for Reliability Analysis -- --

1. Introduction to Reliability and Its Importance -- 1.1. Introduction -- 2. Reliability Metrology -- 2.1. The Definition of Reliability -- 2.2. Empirical Models -- 2.3. Physical Models -- 2.4. Reliability Information -- 2.5. Interconnection Reliability -- 2.6. The Levels of Interconnections -- 2.7. Reliability Function -- 2.7.1. Exponential Distribution -- 2.7.2. Weibull Distribution -- 2.7.3. Log-Normal Distribution -- 2.7.4. Physical Basis of the Distributions -- 2.8. A Generic Weibull Distribution Model to Predict Reliability of Microsystems -- 2.8.1. Failure-Criteria Dependence of the Location Parameter -- 2.8.2. Least Squares Estimation -- 2.8.3. The Experiment and Data -- 2.8.4. Analysis and the Results -- 2.8.5. Application of the Results -- 3. General Failure Mechanisms of Microsystems -- 3.1. Introduction -- 3.2. Mechanical and Thermomechanical Failure Mechanisms -- 3.2.1. Low Cycle Fatigue -- 3.2.2. Creep -- 3.3. Brittle Fracture -- 3.4. IC Level Failure Mechanisms -- 3.4.1. Electromigration -- 3.4.2. Electrostatic Discharge -- 3.5. Corrosion -- 3.6. Plastic Package Popcorning -- 4. Solder Joint Reliability -- 4.1. Microstructure of Solder Joints -- 4.1.1. Microstructure of Eutectic Sn-37Pb -- 4.1.2. Microstructural Stability and Interfacial Interactions -- 4.1.3. Microstructure of Eutectic Sn-3.5Ag -- 4.1.4. Microstructural Evolution and Interfacial Interactions -- 4.1.5. Microstructure of Sn-Ag-Cu Alloys -- 4.1.6. Microstructural Evolution and Interfacial Interactions -- 4.1.7. Microstructure of Sn-3.5Ag-3Bi -- 4.1.8. Microstructure of Sn-07Cu0.4Co -- 4.2. Mechanical Reliability of Solder Joints -- 4.2.1. Fatigue Failure -- 4.3. General Solder Joint Failure Mechanism -- 4.3.1. Effect of Second Level Solder Interconnection Failure -- 4.3.2. Standards Related to Solder Joint Reliability Testing -- 5. Conductive Adhesive Joint Reliability -- 5.1. Introduction to Conductive Adhesives -- 5.2. Isotropic Conductive Adhesive -- 5.3. Reliability of ICA Interconnects -- 5.3.1. Effect of Metallization -- 5.3.2. Effect of Curing Degree -- 5.3.3. Impact Strength -- 5.3.4. Failure Mechanisms -- 5.3.5. Electron Conduction Through Nanoparticles in ICA -- 5.4. Reliability of ACA Interconnects -- 5.4.1. Effects of Assembly Process -- 5.4.2. Effects of Substrate and Component -- 5.4.3. Degradation Due to Moisture Absorption -- 5.4.4. Oxidation and Crack Growth -- 5.4.5. Probabilities of Open and Bridging -- 5.4.6. ACA Flow During Bonding -- 5.4.7. Electrical Conduction Development and Residual Stresses -- 6. Accelerated Testing -- 6.1. Fatigue Failure Analysis for Accelerated Testing -- 6.2. Thermal Fatigue -- 6.3. Effect of Different Test Factors on Thermal Fatigue Life -- 6.4. Isothermal Mechanical LCF -- 6.4.1. Effect of Frequency -- 6.4.2. Effect of Dwell (Hold) Time -- 6.4.3. Effect of Strain Range and Strain Rate -- 6.4.4. Effect of Temperature -- 6.4.5. Effect of Failure Definition -- 6.4.6. Effect of Other Factors -- 7. Reliability Design for Manufacturability -- 7.1. Lead-Free Soldering -- 7.1.1. Higher Process Temperature -- 7.2. Other Issues -- 7.2.1. Lead Contamination -- 7.2.2. Tin Whiskers -- 7.3. Inspection -- 7.4. Repair and Rework -- 8. Component Reliability -- 8.1. Introduction -- 8.2. Empirical Models -- 8.3. The Methodology -- 8.4. Empirical Models in System Reliability Analysis -- 8.5. Limitations of Empirical Models and Recommendations on Use -- 9. System Level Reliability -- 9.1. Introduction -- 9.2. Some Constant Hazard Rate Approximations of the Weibull Distribution -- 9.3. Resulting Functions and Hazard Rates -- 9.4. Properties of Different Options -- 9.5. Comparison of the Selected Options -- 9.6. Selection of Time Intervals -- 9.7. The Motivation for Selecting Two-Parameter Weibull Distribution -- 9.8. Constant Failure Rate and Its Origin in the Field Failure Data -- 10. Reliability and Quality Management of Microsystem -- 10.1. Introduction -- 10.2. Activity 1: Product Requirements and Constraints -- 10.3. Activity 2: Product Life-Cycle Conditions -- 10.4. Activity 3: Selection and Characterization of Alternative Product Architectures and Manufacturing Processes -- 10.5. Activity 4: Qualification of Packaging Concepts and Manufacturing Processes -- 10.5.1. Manufacturability -- 10.5.2. Reliability -- 10.5.3. Maintainability -- 10.5.4. Environmental Compatibility -- 10.6. Activity 5: Risk Management and Balance of Functionality, Quality, and Cost Requirements -- 10.6.1. Risk Management of Supplied Materials and Parts -- 10.6.2. Risk Management of Manufacturing Processes and New Technologies -- 10.6.3. Failure Modes and Effects Analysis -- 10.6.4. Protective Measures -- 10.7. Activity 6: Quality Controls and Improvement of Design, Materials, Parts, and Manufacturing Processes -- 10.7.1. Design Defects -- 10.7.2. Defects Caused by Manufacturing Processes -- 10.8. Activity 7: Failure Analysis and Feedback of Gained Knowledge -- 11. Experimental Tools for Reliability Analysis -- 11.1. Optical Microscopy -- 11.2. Scanning Electron Microscopy -- 11.3. Energy-Dispersive X-Ray -- 11.4. Scanning Acoustic Microscopy -- 11.5. X-Ray -- 11.6. Low-Cycle Fatigue Testing -- 11.7. Shear Testing -- 11.8. Humidity and Temperature Testing -- 11.9. Thermal Shock and Thermal Cycling Testing -- 11.10. Moire Interferometry.

"Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail"--Publisher's website.

Machine converted from AACR2 source record.

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