MARC details
| 000 -LEADER |
|---|
| fixed length control field |
08100cam a22004334i 4500 |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
|---|
| control field |
20221102155350.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
|---|
| fixed length control field |
110404s2011 nyua b 001 0 eng d |
| 010 ## - LIBRARY OF CONGRESS CONTROL NUMBER |
|---|
| LC control number |
2011920685 |
| 011 ## - LINKING LIBRARY OF CONGRESS CONTROL NUMBER [OBSOLETE] |
|---|
| Local cataloguing issues note |
BIB MATCHES WORLDCAT |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
1441957596 |
| Qualifying information |
hbk. |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
9781441957597 |
| Qualifying information |
hbk. |
| 035 ## - SYSTEM CONTROL NUMBER |
|---|
| System control number |
(OCoLC)473464929 |
| 040 ## - CATALOGING SOURCE |
|---|
| Original cataloging agency |
UKM |
| Language of cataloging |
eng |
| Description conventions |
rda |
| Transcribing agency |
UKM |
| Modifying agency |
YDXCP |
| -- |
BWX |
| -- |
CDX |
| -- |
IXA |
| -- |
WAU |
| -- |
NDD |
| -- |
ATU |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER |
|---|
| Classification number |
TK7875 |
| Item number |
.R45 2011 |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER |
|---|
| Classification number |
621.381 |
| Edition number |
22 |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
|---|
| Personal name |
Liu, Johan, |
| Relator term |
author. |
| 9 (RLIN) |
1085562 |
| 245 10 - TITLE STATEMENT |
|---|
| Title |
Reliability of microtechnology : |
| Remainder of title |
interconnects, devices, and systems / |
| Statement of responsibility, etc. |
Johan Liu [and others]. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE |
|---|
| Place of production, publication, distribution, manufacture |
New York ; |
| -- |
London : |
| Name of producer, publisher, distributor, manufacturer |
Springer, |
| Date of production, publication, distribution, manufacture, or copyright notice |
[2011] |
| 264 #4 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE |
|---|
| Date of production, publication, distribution, manufacture, or copyright notice |
©2011 |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
xiii, 204 pages : |
| Other physical details |
illustrations ; |
| Dimensions |
24 cm |
| 336 ## - CONTENT TYPE |
|---|
| Content type term |
text |
| Content type code |
txt |
| Source |
rdacontent |
| 337 ## - MEDIA TYPE |
|---|
| Media type term |
unmediated |
| Media type code |
n |
| Source |
rdamedia |
| 338 ## - CARRIER TYPE |
|---|
| Carrier type term |
volume |
| Carrier type code |
nc |
| Source |
rdacarrier |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE |
|---|
| Bibliography, etc. note |
Includes bibliographical references and index. |
| 505 0# - FORMATTED CONTENTS NOTE |
|---|
| Formatted contents note |
1. Introduction to Reliability and Its Importance -- 2. Reliability Metrology -- 3. General Failure Mechanisms of Microsystems -- 4. Solder Joint Reliability -- 5. Conductive Adhesive Joint Reliability -- 6. Accelerated Testing -- 7. Reliability Design for Manufacturability -- 8. Component Reliability -- 9. System Level Reliability -- 10. Reliability and Quality Management of Microsystem -- 11. Experimental Tools for Reliability Analysis -- -- |
| 505 00 - FORMATTED CONTENTS NOTE |
|---|
| Miscellaneous information |
1. |
| Title |
Introduction to Reliability and Its Importance -- |
| Miscellaneous information |
1.1. |
| Title |
Introduction -- |
| Miscellaneous information |
2. |
| Title |
Reliability Metrology -- |
| Miscellaneous information |
2.1. |
| Title |
The Definition of Reliability -- |
| Miscellaneous information |
2.2. |
| Title |
Empirical Models -- |
| Miscellaneous information |
2.3. |
| Title |
Physical Models -- |
| Miscellaneous information |
2.4. |
| Title |
Reliability Information -- |
| Miscellaneous information |
2.5. |
| Title |
Interconnection Reliability -- |
| Miscellaneous information |
2.6. |
| Title |
The Levels of Interconnections -- |
| Miscellaneous information |
2.7. |
| Title |
Reliability Function -- |
| Miscellaneous information |
2.7.1. |
| Title |
Exponential Distribution -- |
| Miscellaneous information |
2.7.2. |
| Title |
Weibull Distribution -- |
| Miscellaneous information |
2.7.3. |
| Title |
Log-Normal Distribution -- |
| Miscellaneous information |
2.7.4. |
| Title |
Physical Basis of the Distributions -- |
| Miscellaneous information |
2.8. |
| Title |
A Generic Weibull Distribution Model to Predict Reliability of Microsystems -- |
| Miscellaneous information |
2.8.1. |
| Title |
Failure-Criteria Dependence of the Location Parameter -- |
| Miscellaneous information |
2.8.2. |
| Title |
Least Squares Estimation -- |
| Miscellaneous information |
2.8.3. |
| Title |
The Experiment and Data -- |
| Miscellaneous information |
2.8.4. |
| Title |
Analysis and the Results -- |
| Miscellaneous information |
2.8.5. |
| Title |
Application of the Results -- |
| Miscellaneous information |
3. |
| Title |
General Failure Mechanisms of Microsystems -- |
| Miscellaneous information |
3.1. |
| Title |
Introduction -- |
| Miscellaneous information |
3.2. |
| Title |
Mechanical and Thermomechanical Failure Mechanisms -- |
| Miscellaneous information |
3.2.1. |
| Title |
Low Cycle Fatigue -- |
| Miscellaneous information |
3.2.2. |
| Title |
Creep -- |
| Miscellaneous information |
3.3. |
| Title |
Brittle Fracture -- |
| Miscellaneous information |
3.4. |
| Title |
IC Level Failure Mechanisms -- |
| Miscellaneous information |
3.4.1. |
| Title |
Electromigration -- |
| Miscellaneous information |
3.4.2. |
| Title |
Electrostatic Discharge -- |
| Miscellaneous information |
3.5. |
| Title |
Corrosion -- |
| Miscellaneous information |
3.6. |
| Title |
Plastic Package Popcorning -- |
| Miscellaneous information |
4. |
| Title |
Solder Joint Reliability -- |
| Miscellaneous information |
4.1. |
| Title |
Microstructure of Solder Joints -- |
| Miscellaneous information |
4.1.1. |
| Title |
Microstructure of Eutectic Sn-37Pb -- |
| Miscellaneous information |
4.1.2. |
| Title |
Microstructural Stability and Interfacial Interactions -- |
| Miscellaneous information |
4.1.3. |
| Title |
Microstructure of Eutectic Sn-3.5Ag -- |
| Miscellaneous information |
4.1.4. |
| Title |
Microstructural Evolution and Interfacial Interactions -- |
| Miscellaneous information |
4.1.5. |
| Title |
Microstructure of Sn-Ag-Cu Alloys -- |
| Miscellaneous information |
4.1.6. |
| Title |
Microstructural Evolution and Interfacial Interactions -- |
| Miscellaneous information |
4.1.7. |
| Title |
Microstructure of Sn-3.5Ag-3Bi -- |
| Miscellaneous information |
4.1.8. |
| Title |
Microstructure of Sn-07Cu0.4Co -- |
| Miscellaneous information |
4.2. |
| Title |
Mechanical Reliability of Solder Joints -- |
| Miscellaneous information |
4.2.1. |
| Title |
Fatigue Failure -- |
| Miscellaneous information |
4.3. |
| Title |
General Solder Joint Failure Mechanism -- |
| Miscellaneous information |
4.3.1. |
| Title |
Effect of Second Level Solder Interconnection Failure -- |
| Miscellaneous information |
4.3.2. |
| Title |
Standards Related to Solder Joint Reliability Testing -- |
| Miscellaneous information |
5. |
| Title |
Conductive Adhesive Joint Reliability -- |
| Miscellaneous information |
5.1. |
| Title |
Introduction to Conductive Adhesives -- |
| Miscellaneous information |
5.2. |
| Title |
Isotropic Conductive Adhesive -- |
| Miscellaneous information |
5.3. |
| Title |
Reliability of ICA Interconnects -- |
| Miscellaneous information |
5.3.1. |
| Title |
Effect of Metallization -- |
| Miscellaneous information |
5.3.2. |
| Title |
Effect of Curing Degree -- |
| Miscellaneous information |
5.3.3. |
| Title |
Impact Strength -- |
| Miscellaneous information |
5.3.4. |
| Title |
Failure Mechanisms -- |
| Miscellaneous information |
5.3.5. |
| Title |
Electron Conduction Through Nanoparticles in ICA -- |
| Miscellaneous information |
5.4. |
| Title |
Reliability of ACA Interconnects -- |
| Miscellaneous information |
5.4.1. |
| Title |
Effects of Assembly Process -- |
| Miscellaneous information |
5.4.2. |
| Title |
Effects of Substrate and Component -- |
| Miscellaneous information |
5.4.3. |
| Title |
Degradation Due to Moisture Absorption -- |
| Miscellaneous information |
5.4.4. |
| Title |
Oxidation and Crack Growth -- |
| Miscellaneous information |
5.4.5. |
| Title |
Probabilities of Open and Bridging -- |
| Miscellaneous information |
5.4.6. |
| Title |
ACA Flow During Bonding -- |
| Miscellaneous information |
5.4.7. |
| Title |
Electrical Conduction Development and Residual Stresses -- |
| Miscellaneous information |
6. |
| Title |
Accelerated Testing -- |
| Miscellaneous information |
6.1. |
| Title |
Fatigue Failure Analysis for Accelerated Testing -- |
| Miscellaneous information |
6.2. |
| Title |
Thermal Fatigue -- |
| Miscellaneous information |
6.3. |
| Title |
Effect of Different Test Factors on Thermal Fatigue Life -- |
| Miscellaneous information |
6.4. |
| Title |
Isothermal Mechanical LCF -- |
| Miscellaneous information |
6.4.1. |
| Title |
Effect of Frequency -- |
| Miscellaneous information |
6.4.2. |
| Title |
Effect of Dwell (Hold) Time -- |
| Miscellaneous information |
6.4.3. |
| Title |
Effect of Strain Range and Strain Rate -- |
| Miscellaneous information |
6.4.4. |
| Title |
Effect of Temperature -- |
| Miscellaneous information |
6.4.5. |
| Title |
Effect of Failure Definition -- |
| Miscellaneous information |
6.4.6. |
| Title |
Effect of Other Factors -- |
| Miscellaneous information |
7. |
| Title |
Reliability Design for Manufacturability -- |
| Miscellaneous information |
7.1. |
| Title |
Lead-Free Soldering -- |
| Miscellaneous information |
7.1.1. |
| Title |
Higher Process Temperature -- |
| Miscellaneous information |
7.2. |
| Title |
Other Issues -- |
| Miscellaneous information |
7.2.1. |
| Title |
Lead Contamination -- |
| Miscellaneous information |
7.2.2. |
| Title |
Tin Whiskers -- |
| Miscellaneous information |
7.3. |
| Title |
Inspection -- |
| Miscellaneous information |
7.4. |
| Title |
Repair and Rework -- |
| Miscellaneous information |
8. |
| Title |
Component Reliability -- |
| Miscellaneous information |
8.1. |
| Title |
Introduction -- |
| Miscellaneous information |
8.2. |
| Title |
Empirical Models -- |
| Miscellaneous information |
8.3. |
| Title |
The Methodology -- |
| Miscellaneous information |
8.4. |
| Title |
Empirical Models in System Reliability Analysis -- |
| Miscellaneous information |
8.5. |
| Title |
Limitations of Empirical Models and Recommendations on Use -- |
| Miscellaneous information |
9. |
| Title |
System Level Reliability -- |
| Miscellaneous information |
9.1. |
| Title |
Introduction -- |
| Miscellaneous information |
9.2. |
| Title |
Some Constant Hazard Rate Approximations of the Weibull Distribution -- |
| Miscellaneous information |
9.3. |
| Title |
Resulting Functions and Hazard Rates -- |
| Miscellaneous information |
9.4. |
| Title |
Properties of Different Options -- |
| Miscellaneous information |
9.5. |
| Title |
Comparison of the Selected Options -- |
| Miscellaneous information |
9.6. |
| Title |
Selection of Time Intervals -- |
| Miscellaneous information |
9.7. |
| Title |
The Motivation for Selecting Two-Parameter Weibull Distribution -- |
| Miscellaneous information |
9.8. |
| Title |
Constant Failure Rate and Its Origin in the Field Failure Data -- |
| Miscellaneous information |
10. |
| Title |
Reliability and Quality Management of Microsystem -- |
| Miscellaneous information |
10.1. |
| Title |
Introduction -- |
| Miscellaneous information |
10.2. |
| Title |
Activity 1: Product Requirements and Constraints -- |
| Miscellaneous information |
10.3. |
| Title |
Activity 2: Product Life-Cycle Conditions -- |
| Miscellaneous information |
10.4. |
| Title |
Activity 3: Selection and Characterization of Alternative Product Architectures and Manufacturing Processes -- |
| Miscellaneous information |
10.5. |
| Title |
Activity 4: Qualification of Packaging Concepts and Manufacturing Processes -- |
| Miscellaneous information |
10.5.1. |
| Title |
Manufacturability -- |
| Miscellaneous information |
10.5.2. |
| Title |
Reliability -- |
| Miscellaneous information |
10.5.3. |
| Title |
Maintainability -- |
| Miscellaneous information |
10.5.4. |
| Title |
Environmental Compatibility -- |
| Miscellaneous information |
10.6. |
| Title |
Activity 5: Risk Management and Balance of Functionality, Quality, and Cost Requirements -- |
| Miscellaneous information |
10.6.1. |
| Title |
Risk Management of Supplied Materials and Parts -- |
| Miscellaneous information |
10.6.2. |
| Title |
Risk Management of Manufacturing Processes and New Technologies -- |
| Miscellaneous information |
10.6.3. |
| Title |
Failure Modes and Effects Analysis -- |
| Miscellaneous information |
10.6.4. |
| Title |
Protective Measures -- |
| Miscellaneous information |
10.7. |
| Title |
Activity 6: Quality Controls and Improvement of Design, Materials, Parts, and Manufacturing Processes -- |
| Miscellaneous information |
10.7.1. |
| Title |
Design Defects -- |
| Miscellaneous information |
10.7.2. |
| Title |
Defects Caused by Manufacturing Processes -- |
| Miscellaneous information |
10.8. |
| Title |
Activity 7: Failure Analysis and Feedback of Gained Knowledge -- |
| Miscellaneous information |
11. |
| Title |
Experimental Tools for Reliability Analysis -- |
| Miscellaneous information |
11.1. |
| Title |
Optical Microscopy -- |
| Miscellaneous information |
11.2. |
| Title |
Scanning Electron Microscopy -- |
| Miscellaneous information |
11.3. |
| Title |
Energy-Dispersive X-Ray -- |
| Miscellaneous information |
11.4. |
| Title |
Scanning Acoustic Microscopy -- |
| Miscellaneous information |
11.5. |
| Title |
X-Ray -- |
| Miscellaneous information |
11.6. |
| Title |
Low-Cycle Fatigue Testing -- |
| Miscellaneous information |
11.7. |
| Title |
Shear Testing -- |
| Miscellaneous information |
11.8. |
| Title |
Humidity and Temperature Testing -- |
| Miscellaneous information |
11.9. |
| Title |
Thermal Shock and Thermal Cycling Testing -- |
| Miscellaneous information |
11.10. |
| Title |
Moire Interferometry. |
| 520 ## - SUMMARY, ETC. |
|---|
| Summary, etc. |
"Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail"--Publisher's website. |
| 588 ## - SOURCE OF DESCRIPTION NOTE |
|---|
| Source of description note |
Machine converted from AACR2 source record. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Microelectromechanical systems |
| 9 (RLIN) |
328799 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Nanotechnology. |
| 9 (RLIN) |
327594 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Electronics. |
| 9 (RLIN) |
345131 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Engineering. |
| 9 (RLIN) |
317322 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Optical materials |
| 9 (RLIN) |
335574 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
System safety |
| 9 (RLIN) |
324753 |
| 907 ## - LOCAL DATA ELEMENT G, LDG (RLIN) |
|---|
| a |
.b11922102 |
| b |
22-08-17 |
| c |
27-10-15 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
|---|
| Koha item type |
Book |
| 945 ## - LOCAL PROCESSING INFORMATION (OCLC) |
|---|
| a |
621.381 REL |
| g |
1 |
| i |
A502395B |
| j |
0 |
| l |
cmain |
| o |
- |
| p |
$157.69 |
| q |
- |
| r |
- |
| s |
- |
| t |
0 |
| u |
1 |
| v |
0 |
| w |
0 |
| x |
1 |
| y |
.i13132192 |
| z |
29-10-15 |
| 998 ## - LOCAL CONTROL INFORMATION (RLIN) |
|---|
| -- |
b |
| -- |
c |
| Operator's initials, OID (RLIN) |
06-04-16 |
| Cataloger's initials, CIN (RLIN) |
m |
| First date, FD (RLIN) |
a |
| -- |
eng |
| -- |
nyu |
| -- |
0 |
