TY  - BOOK
AU  - Lee,Ning-Cheng
TI  - Reflow soldering processes: SMT, BGA, CSP and flip chip technologies 
SN  - 0750672188
AV  - TK7836. L43 2002
U1  - 621.381046 
PY  - 2002///]
CY  - Boston
PB  - Newnes
KW  - Electronic apparatus and appliances
KW  - Design and construction
KW  - Solder and soldering
KW  - Electronic packaging
KW  - Electric connectors
N1  - Includes bibliographical references and index; 1; Introduction to Surface Mount Technology --; 2; Fundamentals of Solders and Soldering --; 3; Solder Past Technology --; 4; Surface Mount Assembly Processes --; 5; SMT Problems Prior to Reflow --; 6; SMT Problems During Reflow --; 7; SMT Problems at the Post-reflow Stage --; 8; Solder Bumping for Area Array Packages --; 9; BGA and CSP Assembly and Rework --; 10; Flip Chip Reflow Attachment --; 11; Optimizing a Reflow Profile Via Defect Mechanisms Analysis --; 12; Lead-free Soldering
ER  -